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| 1.5 GHz Low Noise Silicon MMIC Amplifier Technical Data INA-52063 Features * Ultra-Miniature Package * Single 5 V Supply (30 mA) * 22 dB Gain * 8 dBm P1dB * Unconditionally Stable Surface Mount SOT-363 (SC-70) Package Description Hewlett-Packard's INA-52063 is a Silicon monolithic amplifier that offers excellent gain and power output for applications to 1.5 GHz. Packaged in an ultraminiature SOT-363 package, it requires half the board space of a SOT-143 package. The INA-52063 is fabricated using HP's 30 GHz fMAX ISOSATTM Silicon bipolar process which uses nitride self-alignment submicrometer lithography, trench isolation, ion implantation, gold metallization, and polyimide intermetal dielectric and scratch protection to achieve superior performance, uniformity, and reliability. Applications * Amplifier for Cellular, Cordless, Special Mobile Radio, PCS, ISM, Wireless LAN, DBS, TVRO, and TV Tuner Applications Pin Connections and Package Marking GND 2 OUTPUT 6 and V CC 5 GND 3 4 VCC 52 GND 1 INPUT 3 Note: Package marking provides orientation and identification. Equivalent Circuit (Simplified) VCC RF OUTPUT & VCC RF INPUT GROUND 1 GROUND 2 GROUND 3 5965-9681E 6-156 Absolute Maximum Ratings Symbol VCC Pin Tj TSTG Parameter Supply Voltage, to Ground CW RF Input Power Junction Temperature Storage Temperature Units V dBm C C Absolute Maximum[1] 12 +13 150 -65 to 150 Thermal Resistance[2]: j-c = 170C/W Notes: 1. Operation of this device above any one of these limits may cause permanent damage. 2. TC = 25C (TC is defined to be the temperature at the package pins where contact is made to the circuit board) INA-52063 Electrical Specifications, TC = 25C, ZO = 50 , VCC = 5 V, unless noted Symbol Gp NF P1dB IP3 IP3 VSWR ICC d Parameters and Test Conditions Power Gain (|S21|2) Noise Figure Output Power at 1 dB Gain Compression Third Order Intercept Point Third Order Intercept Point Input VSWR Output VSWR Device Current Group Delay f = 900 MHz f = 900 MHz f = 900 MHz f = 900 MHz f = 900 MHz f = 2100 MHz f = 900 MHz f = 900 MHz mA ps Units dB dB dBm dBm dBm Min. 20 Typ. 22 4.0 + 8 +20 +15 1.4 1.3 30 238 38 Max. 6-157 INA-52063 Typical Performance, TC = 25C, ZO = 50 , VCC = 5 V, unless noted 24.0 23.0 22.0 21.0 GAIN (dB) 6.0 5.5 V 5.0 V 4.5 V NOISE FIGURE (dB) 12.0 5.5 5.5 V 5.0 V 4.5 V P1dB (dBm) 11.0 10.0 9.0 8.0 7.0 6.0 5.0 5.5 V 5.0 V 4.5 V 0.30 0.60 1.20 1.80 2.40 20.0 19.0 18.0 17.0 16.0 15.0 0.05 0.65 1.25 1.85 2.45 5.0 4.5 4.0 4.0 3.0 3.5 0.09 0.2 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 FREQUENCY (GHz) 2.0 0.05 FREQUENCY (GHz) FREQUENCY (GHz) Figure 1. Gain vs. Frequency and Voltage. Figure 2. Noise Figure vs. Frequency and Voltage. Figure 3. Output Power for 1 dB Gain Compression vs. Frequency and Voltage. 12 24.0 23.0 22.0 21.0 GAIN (dB) 7.0 -40 C +25 C +85 C NOISE FIGURE (dB) 6.5 6.0 5.5 5.0 4.5 4.0 3.5 -40 C +25 C +85 C P1dB (dBm) 11 10 9 8 7 6 5 -40 C +25 C +85 C 20.0 19.0 18.0 17.0 16.0 15.0 0.05 0.60 1.20 1.80 2.40 3.0 0.05 0.40 0.80 1.20 1.60 2.00 2.40 4 0.05 0.30 0.60 1.20 1.80 2.40 FREQUENCY (GHz) FREQUENCY (GHz) FREQUENCY (GHz) Figure 4. Gain vs. Frequency and Temperature. Figure 5. Noise Figure vs. Frequency and Temperature. Figure 6. Output Power for 1 dB Gain Compression vs. Frequency and Temperature. 2.2 2.0 1.8 VSWR (dB) 60 VSWR IN VSWR OUT 50 40 ICC (mA) -40 C +25 C +85 C 1.6 1.4 1.2 1.0 0.0 5 30 20 10 0 0.0 0.4 0 0.7 1.1 1.4 1.8 5 5 0 0 FREQUENCY (GHz) 2.1 5 2.5 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 VCC (V) Figure 7. Input and Output VSWR vs. Frequency. Figure 8. Supply Current vs. Voltage and Temperature. 6-158 INA-52063 Typical Scattering Parameters[3], TC = 25C, ZO = 50 , VCC = 5.0 V Freq. GHz 0.05 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.20 1.40 1.60 1.80 2.00 2.20 2.40 2.60 2.80 3.00 S11 Mag 0.06 0.06 0.06 0.07 0.07 0.09 0.10 0.12 0.13 0.15 0.17 0.21 0.24 0.27 0.30 0.32 0.33 0.35 0.36 0.36 0.36 Ang 165 154 131 104 80 66 46 30 14 0 -12 -33 -50 -66 -80 -93 -105 -117 -128 -139 -149 dB 23.5 23.4 23.4 23.3 23.1 23.0 22.8 22.6 22.3 22.0 21.7 21.0 20.2 19.4 18.6 17.8 17.1 16.3 15.5 14.8 14.1 S21 Mag 14.88 14.84 14.72 14.57 14.33 14.08 13.76 13.41 13.01 12.59 12.14 11.22 10.28 9.38 8.55 7.80 7.13 6.52 5.98 5.52 5.08 Ang -5 -9 -19 -28 -37 -46 -55 -64 -73 -82 -90 -106 -122 -137 -151 -164 -177 170 159 147 136 dB -29.3 -29.3 -29.4 -29.5 -29.4 -29.4 -29.4 -29.3 -29.2 -29.0 -28.8 -28.4 -28.1 -27.7 -27.5 -27.4 -27.6 -27.8 -28.1 -28.9 -29.5 S12 Mag 0.034 0.034 0.034 0.034 0.034 0.034 0.034 0.034 0.035 0.036 0.036 0.038 0.040 0.041 0.042 0.043 0.042 0.041 0.039 0.036 0.033 S22 Ang 0 0 0 1 2 3 4 5 6 6 7 7 6 4 2 -1 -5 -8 -12 -15 -16 Mag 0.05 0.05 0.05 0.06 0.07 0.08 0.09 0.11 0.13 0.14 0.16 0.20 0.23 0.25 0.27 0.29 0.30 0.31 0.32 0.33 0.33 Ang 1 0 -1 -5 -10 -14 -21 -29 -37 -45 -52 -67 -81 -94 -107 -118 -129 -139 -149 -158 -168 K Factor 1.24 1.24 1.25 1.25 1.26 1.27 1.28 1.29 1.28 1.27 1.28 1.25 1.24 1.26 1.29 1.33 1.44 1.56 1.74 2.01 2.37 Note: 3. Reference plane per Figure 9 in Applications Information section. INA-52063 Applications Information Introduction The INA-52063 is a silicon RFIC amplifier that is designed with an internal resistive feedback network to provide a 50 input and 50 output impedance. With a Third Order Intercept Point of +20 dBm and a low Noise Figure of 4 dB, the INA-52063 is especially useful for RF and IF amplifier applications requiring high dynamic ranges. Phase Reference Planes The positions of the reference planes used to measure S-Parameters for this device are shown in Figure 9. As seen in the illustration, the reference planes are located at the point where the package leads contact the test circuit. SOT-363 PCB Layout The INA-52063 is packaged in the miniature SOT-363 (SC-70) surface mount package. A PCB pad layout for the SOT-363 package is shown in Figure 10 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding pad parasitics that could impair the high frequency performance of the INA-52063. The layout is shown with a nominal SOT-363 package footprint superimposed on the PCB pads for reference. 0.026 REFERENCE PLANES 0.035 0.07 TEST CIRCUIT 0.016 Figure 9. Phase Reference Planes. Figure 10. PCB Pad Layout (dimensions in inches). 6-159 Operating Details The INA-52063 is a voltage biased device that operates from a +5 volt power supply with a typical current drain of 30 mA. All bias regulation circuitry is integrated into the RFIC. Figure 11 shows a typical implementation of the INA-52063. The supply voltage for the INA-52063 must be applied to two terminals, the VCC pin and the RF Output pin. The VCC connection to the amplifier is RF bypassed by placing a capacitor to ground near the VCC pin of the amplifier package. The power supply connection to the RF Output pin is achieved by means of a RF choke (inductor). The value of the RF choke must be large relative to 50 in order to prevent loading of the RF Output. The supply voltage end of the RF choke is bypassed to ground with a capacitor. If the physical layout permits, this can be the same bypass capacitor that is used at the VCC terminal of the amplifier. Blocking capacitors are normally placed in series with the RF Input and the RF Output to isolate the DC voltages on these pins from circuits adjacent to the amplifier. The values for the blocking and bypass capacitors are selected to provide a reactance at the lowest frequency of operation that is small relative to 50 . RF Layout An example layout for an amplifier using the INA-52063 is shown in Figure 12. This example uses a microstripline design (solid groundplane on the back side of the circuit board). The circuit board material is 0.031-inch thick FR-4. Plated through holes (vias) are used to bring the ground to the top side of the circuit where needed. Multiple vias are used to reduce the inductance of the path to ground. Figure 13 shows an assembled amplifier. The +5 volt supply is fed directly into the VCC pin of the INA-52063 and into the RF Output pin through the RF choke (RFC). Capacitor C3 provides RF bypassing for both the VCC pin and the power supply end of the RFC. Capacitor C4 is optional and may be used to add additional bypassing for the VCC line. A well bypassed VCC line is especially necessary in cascades of amplifier stages to prevent oscillation that may occur as a result of RF feedback through the power supply lines. For this demonstration circuit, the value chosen for the RF choke was 220 nH (Coilcraft 1008CS-221 or equivalent). All of the blocking and bypass capacitors are 1000 pF. These values provide excellent amplifier performance from under 50 MHz through 1 GHz. Larger values for the choke and capacitors can be used to extend the lower end of the bandwidth. Since the gain of the INA-52063 extends down to DC, the frequency response of the amplifier is limited only by the values of the capacitors and choke. A convenient method for making RF connection to the demonstration board is to use a PCB mounting type of SMA connector (Johanson 142-0701-881, or equivalent). These connectors can be slipped over the edge of the PCB and the center conductors soldered to the input and output lines. The ground pins of the connectors are soldered to the ground plane on the backside of the board. The extra ground pins for the top of the board are not needed and are clipped off. PCB Materials Typical choices for PCB material for low cost wireless applications are FR-4 or G-10 with a thickness of 0.025 or 0.031 inches. A thickness of 0.062 inches is the maximum that is recommended for use with this particular device. The use of a thicker board material increases the inductance of the plated through vias used for RF grounding and may deteriorate circuit performance. Adequate grounding is needed not only to obtain maximum amplifier performance but also to reduce any possibility of instability. H INA-5XX63 DEMO BOARD 05/95 Cblock RF OUTPUT INPUT OUTPUT 52 RFC VCC Cbypass VCC RF INPUT Cblock Figure 11. Basic Amplifier Application. Figure 12. RF Layout. 6-160 H INA-5XX63 DEMO BOARD 05/95 INPUT C1 C2 RFC C3 52 OUTPUT C4 VCC Figure 13. Assembled Amplifier. Package Dimensions Outline 63 (SOT-363/SC-70) 1.30 (0.051) REF. 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.425 (0.017) TYP. 0.30 REF. 1.00 (0.039) 0.80 (0.031) 0.25 (0.010) 0.15 (0.006) 10 0.30 (0.012) 0.10 (0.004) 0.20 (0.008) 0.10 (0.004) DIMENSIONS ARE IN MILLIMETERS (INCHES) INA-52063 Part Number Ordering Information Part Number INA-52063-TR1 INA-52063-BLK Devices per Container 3,000 100 Container 7" reel Antistatic bag 6-161 Device Orientation REEL TOP VIEW 4 mm END VIEW 8 mm CARRIER TAPE USER FEED DIRECTION COVER TAPE 52 52 52 52 Tape Dimensions and Product Orientation For Outline 63 P P0 D P2 E F W C D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) 8 MAX. K0 5 MAX. A0 B0 DESCRIPTION CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER DIAMETER PITCH POSITION WIDTH THICKNESS WIDTH TAPE THICKNESS CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) SYMBOL A0 B0 K0 P D1 D P0 E W t1 C Tt F P2 SIZE (mm) 2.24 0.10 2.34 0.10 1.22 0.10 4.00 0.10 1.00 + 0.25 1.55 0.05 4.00 0.10 1.75 0.10 8.00 0.30 0.255 0.013 5.4 0.10 0.062 0.001 3.50 0.05 2.00 0.05 SIZE (INCHES) 0.088 0.004 0.092 0.004 0.048 0.004 0.157 0.004 0.039 + 0.010 0.061 0.002 0.157 0.004 0.069 0.004 0.315 0.012 0.010 0.0005 0.205 0.004 0.0025 0.00004 0.138 0.002 0.079 0.002 PERFORATION CARRIER TAPE COVER TAPE DISTANCE 6-162 |
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